Analysis of multi-layered microelectronic packaging under uniformly distributed loading
نویسندگان
چکیده
An accurate estimate of interfacial stresses in multi-layered microelectronic packaging is very important for design and prediction of delamination-related failures. An analytical model for stress analysis of multi-layered stacks, which is based on an extension of Valisetty s model (Bending of Beams, Plates and Laminates: Refined Theories and Comparative Studies, Ph.D. thesis, Georgia Institute of Technology, Atlanta, March 1983), is proposed in this paper. This analytical approach considers each layer as a beam-type plate with orthotropic material properties. A new miniature material testing unit is developed. High sensitive Moir e interferometry was used to measure the strain field in the bimaterial interfaces. The test data is in good agreement with the proposed analytical solution. The problem is also analyzed by a finite element analysis. Comparison of all three results indicates that the analytical procedure is far superior to finite element analysis for this problem. 2003 Elsevier Science Ltd. All rights reserved.
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